Intel Firmware Engineer in Boulder, Colorado
Firmware development and debug for Solid State Drive products. Firmware Engineers in NSG perform a range of duties such as: - Collecting and reviewing requirements, and translating those into development tasks- Firmware development of new features to enable new functionality and/or support new HW components- Collaboration with test developers to create automated test cases- Debug of internal and customer issues using an assortment of SW and HW based debug tools and tracing mechanisms
Candidates must possess the below minimum qualifications to be considered for this position.
Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
Candidate must have a Bachelor of Science degree or a Master of Science degree in Computer Science, Computer Engineering or Electrical Engineering.
Minimum of 1 year experience programming in C, C+- Minimum of 6 months experience using scripting languages such as Python or Perl.
Very good teamwork and communication skills.
Experience with Embedded firmware, real-time operating system RTOS, and HW/SW interactions.
Firmware development environments including compilers, debuggers, emulators, and tool-chains.
Experience with hardware/software debugging using logic analyzers and protocol analyzers.
Development of unit tests for code quality validation.
Knowledge of Agile development methodologies.
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
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