Intel Graduate Intern - Technical Solutions Marketing in Folsom, California

Job Description

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

  • The candidate must be pursuing a MS or PhD in Electrical Engineering or Computer Engineering.

  • 6+ months of experience working with C, C++ and Java.

Preferred Qualifications:

  • 6+ months of experience working on debugging, tuning, benchmarking.

  • 6+ months of experience working with scripting for repeatable testing.

  • 6+ months of experience working with Linux Operating System usage.

  • 6+ months of experience working with Windows Systems Administration and Tools.


Work in a lab environment to produce solution benchmark results and end user values in total cost of ownership and value vectors for usage of SSDs as Storage, or extending memory. The internship is valuable to a software or hardware engineer that wishes to learn the full solutions stack in the Data Center context, and responsibilities include: Setting up hardware and defining new or refining existing test procedures. Setting up software and defining the installation and tuning procedures. Running benchmarks and getting consensus from a team to understand the limits of hardware or software and creating the necessary documentation.

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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