Intel High Speed I/O Design Engineer in Folsom, California

Job Description

Designs, develops, modifies and evaluates complex analog and mixed signal electronic parts, components or integrated circuitry for analog and mixed signal electronic equipment and other hardware systems. Determines creative design approaches and parameters. Analyzes equipment to establish operating data. Conducts experimental tests and evaluates results. Applies and uses independent evaluation to selects components and equipment based on analysis of specifications and reliability. Evaluates practical capability of vendor to support product development. Also includes Analog, MixedSignal and RF Development Engineers with specialized skills and expertise in developing Monolithic Integrated Circuits for wireless and wireline communications systems and products using CMOS, BiCMOS, SiGe, GaAs Process technologies.

Qualifications

Job Description: High Speed I/O Design Engineers are responsible for the design and development of the high performance interfaces for electronic components. Responsibilities may include: the design of chip layout, circuit design, circuit checking, device evaluation and characterization, documentation of specifications, prototype construction and checkout, modification and evaluation of semiconductor devices and components, performing developmental and/or test work, reviewing product requirements and logic diagrams, planning and organizing design projects or phases of design projects. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment. Responsibilities Within the Nonvolatile Solutions Group, the candidate is expected to be self-sufficient and to be able to lead a small team. The candidate will be responsible for research and design of circuits for nonvolatile memory components. In this position, you will be developing solutions to problems utilizing formal education and judgment. We are looking for designers who are seeking new opportunities in the non-volatile memory field. Someone who is passionate about working in a small, dynamic environment where the expectation is we contribute in any activity that makes the business successful. Qualifications You must possess a Bachelor's or a Master's degree in Electrical Engineering, Computer Engineering or a related discipline. You must have at least 7 years of circuit design experience. - Highly knowledgeable about multi GT/s interfaces i.e. DDR4/5, PCIe, QPI, etc.- Expertise in CMOS multi GT/s receiver designs, including equalization techniques- In depth hands on experience in designing, testing and validating with nano-scale CMOS technology - Demonstrated leadership in time management and problem solving skills - Experience in leading small teams and task management Preferred Skills: - Experience working with signal integrity analysis - Experience designing systems as well as circuits Job Category: Engineering Primary Location: USA-California, Folsom Organization: TMG Administration Full/Part Time: Full Time

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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