Intel FI Discipline Engineer in Hillsboro, Oregon
The engineer will support and lead projects involving semiconductor fabrication facilities, support buildings, process equipment, and related systems. During these projects this individual will oversee technical design execution, scope creation, data collection, and budget estimation. In addition, the individual will act as a customer engineering representative for Intel. As a representative, this person will interface with a number of internal Intel organizations, equipment suppliers, architectural and engineering firms, and other entities to enable design and construction of Intel equipment and facilities. The individual will also be assigned to a specific process area (Lithography, Etch, Diffusion, etc.) to act as a single point of contact for new engineering and design activities in that area.
Additional responsibilities include but are not limited to:
-Driving consistency in facility and equipment installation processes across Intel’s factories.
-Developing and overseeing execution of engineering processes on a global scale.
-Working with equipment suppliers to drive optimal equipment design and minimize construction and utility usage.
The ideal candidate should exhibit the following behavioral traits:
-Verbal, written, and presentation skills to convey technical information to a variety of personnel, both internal and external to Intel.
-Capability to facilitate a teamwork environment.
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