Intel Lab Technician in Hillsboro, Oregon
In this position, you will be part of a TD and Manufacturing Lab responsible for performing failure analysis and cross-section SEM characterization in support of key far backend TD/ramp programs and high volume production HVM. Conducting hand-on failure analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, polisher to SEM, Dual beam FIB and EDX techniques to characterize Si process to improve process performance and reliability, and to analyze physical failure mode to determine the root-cause. Delivering quality results in a timely fashion to support HVM/TD customer needs Writing reports for routine analysis. Working with engineers and other technicians to coordinate the workload and ensure smooth operations Maintaining lab equipment. Developing lab BKM methods and supporting FBE technology transfer to VF.
The candidate should have the below behavioral traits:
Strong teamwork collaboration with peers. Ability to work in a small team environment, and to work in highly dynamic environment interfacing multiple functional areas
You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
Must have a BS/AS/AAS in Physical Science or Engineering related field or equivalent experience
Must have 3 months experience on analytical tools
Must have unrestricted-permanent right to work in US without requiring sponsorship.
-- SEM, FIB and EDX et al is preferred..
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
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