Intel Pre-Silicon Quality and Reliability Engineer in Hillsboro, Oregon
Component Design Engineers are responsible for the design and development of electronic components. Responsibilities may include: the design of chip layout circuit design, circuit checking, device evaluation and characterization, documentation of specifications, prototype construction and checkout, modification and evaluation of semiconductor devices and components, performing developmental and/or test work, reviewing product requirements and logic diagrams, planning and organizing design projects or phases of design projects. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgement.
You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
The candidates must possess a Bachelor's Degree or a Master's Degree in Electrical Engineering or any other related field of study.
At the Bachelor's level, candidates must have the unrestricted right to work in the US without requiring sponsorship.
Experience in device physics, digital/analog circuit design, physical design-Experience in VLSI design/tool/methodology-Experience in device/circuit/interconnect reliability -Experience using semiconductor industry CAD tools -Experience in developing code using Perl, Tcl or other scripting language -Good communication skill-Ability to work effectively in a team environment.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
Arizona, Phoenix; California, Santa Clara; California, Folsom;
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