Intel Process Engineer in Hillsboro, Oregon
Position description:In this position, you will be a wafer fabrication process engineer in one of two 300mm factories in Aloha Factory Operations AFO in Oregon. The two AFO factories specialize in either back end wafer fabrication thin films deposition, lithography, etch, electroplating or wafer testing. You will be sustaining leading edge processes and tools while processes ramp from development into high volume. What you'll do:As a Module Process Engineer at Intel, you will be responsible for identifying, responding to, and characterizing process tool and defect problems, implementing root cause solutions to those problems, and continuously improving your toolset's safety, quality, velocity, and cost performance. You will also be responsible for:1. Interacting with a technology development organization for new process startup and transfer to a ramping phase. 2. Working with Manufacturing and Yield departments to ensure AFO is the premier far back end and wafer test facility.3. Working towards maintaining multi-generation tool and process synergy through partnerships with other organizations. 4. Interacting with partner factories worldwide to transfer new processes, maintain CE! copy exactly parameters, share learnings and drive improvements.5. Partnering with the Manufacturing Department to assist technicians with their technical development.
- Bachelor's or Master's degree in Chemical Engineering, Electrical Engineering, Materials Science, Physics, or a related engineering field.2. Permanent right to work in the United States.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
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