Intel Thermal Mechanical Engineer in Hillsboro, Oregon
This is a thermal-mechanical engineering position in the Thermal-Mechanical System Engineering Group in the Client Computing Group CCG. Our group develops thermal and mechanical enabling solutions to support the Client silicon roadmap. The thermal and mechanical solutions take the form of system design guides, system guidance, thermal power system management, and platform thermal solutions. The principal responsibility of this position is providing thermal analysis and testing to support our roadmap and new technology development. The engineer will be expected to provide CFD simulations of complex thermal systems, and to design and execute thermal testing of prototype hardware. They will work closely with mechanical designers as well as board and package engineers to create thermal solutions that solve Intel's and our customers' largest challenges at both the system and component level.
You must possess the minimum qualifications below to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Required Qualifications: MS or Ph. D in Mechanical Engineering, Physics, Materials Science, or related fields.  Recognized and verifiable deep technical expertise in area of thermal and mechanical technologies. Demonstrated teamwork, communication, and leadership skills. Excels at cross-functional innovation working with product, design, and system engineering. Preferred Qualifications: PhD preferred. Experience with CFD tools. Experience with cooling of electronic devices .
Inside this Business Group
The Client Computing Group is responsible for all aspects of the client computing business across Phone, Phablet, Tablet and PC platforms, leading Intel's efforts to transform client computing through technologies, new form factors, and driving Intel's corporate-wide user experience initiatives. This spans all client device brands including hardware, software and connectivity ingredients for phones, tablets, Ultrabook™, All-in-Ones, 2 in 1 computing devices, and home gateways.
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