Intel SOC/IP Design/Integration Engineer in Hudson, Massachusetts
As a design and integration engineer, you will be part of the exciting work being done by the SSD Controller Engineering team in Intel's Non-Volatile Memory Solutions Group NSG which is developing Solid-State Drive SSD controller ASICs for both NAND and 3DXP designs. This is an excellent opportunity for a creative and motivated engineer to join NSG on a key technical team working on next-generation products that are critical to Intel's success.In this position, you will be a technical contributor on ASIC IP subsystem projects. This team in Hudson builds ASICs and subsystems and is looking for an experienced design engineer who wants to expand their influence. The design and integration engineer is expected to fill a range of roles, from working on ASIC integration projects, to developing logic in subsystems. This position is located in Hudson, Massachusetts.
The ideal candidate should exhibit the following behavioral traits:o Proven ability to solve digital design problems in a complex environment.o Thorough knowledge of an ASIC design flow.o Ability to describe power and timing intent for the ASIC.o Strong problem-solving debugging skills especially working on problem root-cause, test-failure analysis, & timing analysis.o Ability to prepare and verify ECOs into an ASIC netlist.o Solid verbal and written communication skills.o Motivated, self-directed and able to work effectively both independently and in a team.Minimum Qualifications:o BS or MS Degree in Electrical Engineering, Computer Engineering, or related degrees.o At least 3 years of experience in development of Digital designsPreferred Qualifications:o Knowledge of computer architectureo Knowledge of hierarchical design flowo Experience with SystemVerilog designo Knowledge of SystemVerilog Assertionso Low-power/UPF experience
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
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