Intel Ball Attach Packaging R&D Engineer in Phoenix, Arizona
Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design. Conducts tests and research on basic materials and properties. Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences. Minimum Qualifications:The candidate must possess a Ph.D. in Materials Science, Chemistry, Chemical Engineering, or any other electronics packaging related field. Minimum of 6 months of experience with metals and alloys especially solders, micro- macro structures and phase diagrams. Preferred Qualifications:- Knowledge of mechanical metallurgy, thermodynamics-kinetics of metallurgical reactions, coupling and interaction of dissimilar metals.- Knowledge of physical-chemical-thermal-mechanical properties of metallic materials.- Understanding of metrologies for characterization of metallic materials surface-bulk.- Knowledge of interactions of solders with surface finishes and structure-property-performance of intermetallic. Understanding of interactions of metallic materials with Polymeric materials.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
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