Intel Failure Analysis R&D Engineer in Phoenix, Arizona
Responsible for identifying component failures and researching process/materials improvements to enhance yield, performance, quality and reliability of next generation Product and Package technologies. Conduct hands on lab work, define failure analysis strategy, evaluate the electrical and thermal mechanical characteristics of integrated circuits to determine the root cause of failures and recommend corrective actions working with cross functional teams. Owns the development of innovative fault isolation and failure analysis methods to accelerate failure identification and mechanism understanding on future technologies and products. Drives technology transfer to high volume manufacturing and owns proliferation of shared learning across sites. Maintains necessary records and reports. Performs other related duties as required or as directed.
The ideal candidate will exhibit the following behavioral traits:
Good communication and decision making skills.
Strong teamwork and planning/time management skills.
Able to deliver under pressure in a fast paced environment.
Ability to work well in ambiguous situations.
Mature, self-assured, well organized and attention to detail.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
The candidate must possess a PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemistry, Solid-State Physics or any other related field of study.
• Strong academic background in one or more areas of polymer materials, mechanical behavior of materials, and semiconductor processing and device physics.
• Knowledge and hands on experience in Electrical Fault Isolation, advanced imaging techniques, nondestructive and destructive failure analysis methods, material analysis and characterization methods.
• Familiarity with packaging materials and assembly process, design of experiments and ability to understand complex failure mechanisms and identify root causes of failures working with cross functional teams.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
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