Intel Failure Analysis R&D Engineer in Phoenix, Arizona

Job Description

Responsible for identifying failures and researching process/Product improvements to enhance yield, performance, quality and reliability of next generation Si, Product and Package technologies. Investigates and thoroughly explains fundamental aspects of material/device interactions. Owns the development of electrical, analytical and mechanical methodologies to ensure strategic failure analysis capabilities for future technologies and products. Directs new technology/product transfer, manufacturing startup, and the automation and improvement of the failure analysis process. Owns proliferation of shared learning across sites. Maintains necessary records and reports. Performs other related duties as required or as directed.

The ideal candidate will exhibit the following behavioral traits:

  • Good communication and decision making skills.

  • Strong teamwork, and planning/ management skills.

  • Ability to deliver under pressure.

  • Ability to work well in ambiguous situations.

  • Mature, self-assured, well organized.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

• The candidate must possess a Bachelors or Masters Degree in Physics, Mechanical Engineering, Ultrasound Engineering, Acoustical Engineering, or any other related field of study.

At the Bachelors level, the candidate must have the unrestricted right to work in the US without requiring sponsorship.

Minimum of:

• 12 months experience with Acoustics, Ultrasound Imaging, Ultrasound / Acoustics Non-destructive Testing, Photoacoustics, Laser Ultrasound, or related topic.

• Minimum 3 months experience with programming e.g. Python, LabView, C, MATLAB.

Preferred Qualifications:

  • Experience with Scanning Acoustic Microscopes

  • Experience with ultrasonic transducer design- Academic experience on non-linear acoustics and signal deconvolution.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

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