Intel Failure Analysis R&D Engineer in Phoenix, Arizona
This is a lab hands-on position in which the candidate owns the development of electrical, analytical and mechanical tools and methodologies to ensure strategic fault isolation and failure analysis FI/FA capabilities for future microelectronic package technologies and products. Directly responsible for 2-3 analytical tools, and interacts remotely with supplier's engineers to debug, optimize, and troubleshoot them as needed, and ensures continuous improvements and breakthroughs. Owns proliferation of shared learning across sites. Maintains necessary records and reports. Performs other related duties as required or as directed.
The candidate should possess the below behavioral skills:
Problem solving, out-of-box thinking
Good communication and decision making skills
Strong teamwork and planning/time management skills.
-Able to deliver under pressure
- Ability to work well in ambiguous situations.
-Mature, self-assured, well organized
You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
Must have a Bachelor or Master's degree in Physics, Robotics, Mechatronics, Systems Engineering or related field.
Minimum of 6 months experience with Programming e.g. Python, IDL, LabView, C, MATLAB
Minimum of 12 months experience with Physics
At least 3 months experience automating basic benchtop experimental systems power meters, linear stages, digital cameras, etc
At the Bachelors level, must have unrestricted-permanent right to work in US without requiring sponsorship.
Experience with laser systems
Experience with Fourier-ptychography microscopy
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
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