Intel Microelectronic Packaging Engineer in Phoenix, Arizona
Microelectronic Packaging Engineer provides project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
Will be responsible for influencing the architecture/design, materials selection and structural integrity of high performance IC packages and other associated components and collateral's under manufacturing, test and usage conditions.
Focus on linear and non-linear response analysis and testing of microelectronic packages, devices and enabling components. Is expected to identify, assess and/or develop key analytical techniques. As part of the job function, candidate will also be expected to interact with other engineers to define and execute validation experiments as part of technology and process development.
Applicants must have a legal right to work in the US without sponsorship.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
The candidate must possess a MS or PhD in Mechanical Engineering, Applied Mechanics or a related discipline
Candidate must have work or educational experience in the following: solid mechanics, static and dynamic analyses, metals and polymeric material behavior and failure mechanisms, linear and non-linear finite element methods.
Knowledge of commercial finite element and computational software.
-Applicants must have a legal right to work in the US without sponsorship.
-IC Packaging & PCB technologies Mechanical Design Experimental methods.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
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