Intel Technical Graduate Intern in Phoenix, Arizona

Job Description

Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. In this job, the candidate will be responsible for applying fundamental analysis in fluids, thermals and mechanics to support process development of electronic packages. They will be responsible for developing novel solutions for processing challenges using a combination of CFD and experimentation. They will conducts tests and research on basic material properties. The candidate will provide consultation concerning packaging problems and improvements in the packaging process and respond to customer/client requests or events as they occur. They will develop solutions to problems utilizing formal education and judgment. As part of the job function, they will also be expected to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

  • Be pursuing a MS or PhD in Mechanical Engineering or any other related field of study.

  • 6 + months of experience in hands-on experimental techniques, measurements, data acquisition and automation, preferably for flow related applications.

  • 6 + months of experience in design and CAD applications.

Preferred Qualifications:

  • Knowledge of fluid dynamics, mechanics and heat transfer.

  • Experience in successful application of fluid dynamics fundamentals to their thesis/research work.

  • Experimental research experience in flow measurements and experimental design.

  • Exposure to commercial software such as ANSYS FLUENT, FLOWTHERM, Flow3d, COMSOL.

  • Familiarity with Solid Mechanics and CAD software such as SolidWorks and PRO-E

  • Familiarity with analysis tools like Matlab and MathCAD

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

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