Intel Senior Mechanical Engineer in Santa Clara, California

Job Description

Responsible for 100G, 400G and beyond optical transceiver module mechanical platform development in Intel's Silicon Photonics Products Division. Designs and builds proof-of-concept prototypes as needed of precise die cast and sheet metal parts. Interact and collaborate with broad interdisciplinary team composed of experts in optical devices, electrical ICs, optical and electrical component packaging, PCB design, EMI/thermal design. Engages with external vendors and generates mechanical design specifications for them. Explains and documents design decisions, tradeoffs and analysis to team, design validation, quality and reliability, etc. to deliver optical transceivers from R&D to high-volume production with superior performance, reliability, cost and time to market versus the competition

Qualifications

MS in Mechanical Engineering or similar and 6+ years in related industry experience. Demonstrated ability to create new designs from scratch. Experience using SolidWorks, SolidWork Simulation, ePDM and 3D printers for prototyping designs. Experience with tolerance stack up analyses, FEA, FMEAFluency in GD&T and excellent draftsmanship. Experience designing with tight tolerance requirements. Ability to work independently, without any help, in environment with controversial requirements and priorities. Knowledge of machining, die casting, sheet metal, injection molding manufacturing processes. Strong understanding of precision fabrication technologies and precision metrology measurement. Knowledge of material science corrosion, composites, surface coating and conversion. Ability to balance near term and long term priorities. Experience with mechanical assembly. Hands-on experience developing and working with mechanical systems as well as using basic machine shop equipment. Ability to thrive in a multi-disciplinary team environment. Embrace diversity in a cross culture global organization Additional Desired Qualifications: Familiar with semiconductor packaging and assembly processes such as pick and place machines. Experience with statistical analysis. Knowledge of thermal dissipation and design principles. Knowledge of opto-mechanical design principles. Basic knowledge of optical principles

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