Intel Jobs

Job Information

Intel Defect Metrology (RDA) Engineering Manager in Albuquerque, New Mexico

Job Description

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Job Description

At Intel, we optimize storage and memory from device physics to platform architecture to system level solutions while collaborating with industry leaders to help our customers. We continue to invest in two core technologies: Intel Optane technology that delivers industry-leading low latency (it's super fast!) and Intel 3D NAND technology that delivers high density at low cost.

To deliver the silicon technology, NSG Technology Development group is looking for an experienced Defect Metrology Technology Development Group Leader to help develop 3DxP and NAND technology in F11x, Rio Rancho, NM.

The ideal candidate will have a successful track record of delivering leading edge process capability and demonstrated collaboration with cross-functional/cross-company teams including equipment and material vendors. F11x in Rio Rancho, New Mexico will be Intel's new NVM Technology development site and will focus on 3DxP Technology Development and NAND Technology Research and Pathfinding.

The ideal successful candidate will:

  • The ideal successful candidate will:

  • Demonstrate an in depth knowledge of defect metrology and defect detection techniques.

  • Demonstrate knowledge of all of the inspect tool categories, including ebeam, bright field, dark field, macro and whole wafer, bare wafer, and review tools.

  • Have the ability to pair tool capabilities with current defect issues to ensure adequate detection/metrics.

  • Create innovative techniques using the current tool set, to provide novel inline information.

  • Partner with vendors and equipment engineers to drive future tools to meet upcoming needs.

  • Define the roadmaps to meet requirements, goals and milestones for a new technology process.

  • Ensure an optimal use of people and resources, to balance cycle time with data needs.

  • Establish process controls and reaction mechanisms to protect the fab from excursion events.

  • Develop and execute strategies to drive baseline defectivity down, and increase yield.

  • Develop a team that will provide all process optimization analysis using inline information.

  • Cultivate team members, and develop plans to optimize their skill set for personal progression, and team success.

  • Train production/receiving process engineers, engineering and manufacturing technicians for transfer to other factories.

  • Transfer process to high volume manufacturing and provide support in new factory startup as well as install and qualification of the new production lines

Additional Requirements:

  • Demonstrate experience with technical problem solving skills with multitasking,

  • A fast learner to adapt to the culture and the technology

  • Demonstration experience to work with external and internal partner,

  • Must be flexible in accommodating changing priorities and working hours to support business needs.

Qualifications

Education:

  • PhD degree, Masters or BS, in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Material Science, Physics or Chemistry

Minimum Requirements:

  • Minimum 10 years of hands on experience in semiconductor FAB processing.

  • 10+ years of experience in Defect Inspection process development.

  • At least 5 years of direct experience with leading and managing teams is preferable.

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....

DirectEmployers