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Intel Diffusion/Implant Engineering Manager in Albuquerque, New Mexico

Job Description

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Job Description

At Intel, we optimize storage and memory from device physics to platform architecture to system level solutions while collaborating with industry leaders to help our customers. We continue to invest in two core technologies: Intel Optane technology that delivers industry-leading low latency (it's super fast!) and Intel 3D NAND technology that delivers high density at low cost.

To deliver the silicon technology, NSG Technology Development group is looking for an experienced Diffusion and Implant Technology Development Group Leader to help develop 3DxP and NAND technology in F11x, Rio Rancho, NM.

The ideal candidate will have a successful track record of delivering leading edge process capability and demonstrated collaboration with cross-functional/cross-company teams including equipment and material vendors. F11x in Rio Rancho, New Mexico will be Intel's new NVM Technology development site and will focus on 3DxP Technology Development and NAND Technology Research and Pathfinding.

The ideal successful candidate will:

  • Demonstrate an in depth knowledge of diffusion fundamentals including material science, different techniques used for deposition and anneals of metal and dielectric thin films and metrology techniques used for characterization

  • Have a track record of innovation and invention in the area of diffusion and implant process, equipment and materials, working in a fab in integrated chip process development

  • Strive to achieve and deliver leading edge process capability, yield, cost and manufacturability. This will involve exceptional collaboration with cross-functional/cross-company teams and tool vendors to meet challenging program goals.

  • Define the roadmaps to meet requirements, goals and milestones for a new technology process.

  • Define and establish flow, procedures, and equipment configuration for the module.

  • Select and develop material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements.

  • Plan and conduct experiments to fully characterize the process throughout the development cycle.

  • Drive improvements on quality, reliability, cost, yield, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel.

  • Develop solutions to problems utilizing formal education, statistical knowledge, and problem solving tools

  • Establish process control systems for the process module and sustains the module through volume ramp

  • Develop strategy to resolve difficult problems and establish systems to deal with these problems in the future.

  • Train production/receiving process engineers, engineering and manufacturing technicians for transfer to other factories.

  • Transfer process to high volume manufacturing and provide support in new factory startup as well as install and qualification of the new production lines

  • Have a track record of tool install and fab startup activities for diffusion and implant toolsets.

  • Have a track record of working in collaboration with cross functional teams and installing operation systems in the diffusion and implant modules that enabled fab operations

  • Have a track record of managing employees in a fast paced, dynamic fab environment.

Additional Requirements:

  • Demonstrate experience with technical problem solving skills with multitasking,

  • A fast learner to adapt to the culture and the technology

  • Demonstration experience to work with external and internal partner,

  • Must be flexible in accommodating changing priorities and working hours to support business needs.

Qualifications

Qualifications

Education:

  • PhD degree Or Masters in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Material Science, Physics or Chemistry

Minimum Requirements:

  • Minimum 10 years of hands on experience in semiconductor FAB processing.

  • 10+ years of experience in diffusion and implant process development.

  • At least 5 years of direct experience with leading and managing teams is preferable.

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....

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