Intel Dry Etch TD Equipment Engineer in Albuquerque, New Mexico

Job Description

Dry Etch Technology Development Equipment Engineer

Job Description

At Intel, we optimize storage and memory from device physics to platform architecture to system level solutions while collaborating with industry leaders to help our customers. We continue to invest in two core technologies: Intel Optane technology that delivers industry-leading low latency (it's super fast!) and Intel 3D NAND technology that delivers high density at low cost. F11x in Rio Rancho, New Mexico is Intel's new Non-Volatile Memory Solutions Group (NSG) Technology Development site and will focus on 3DxP Technology Development and NAND Technology Research and Pathfinding.

To deliver the silicon technology, the Intel NSG Rio Rancho Technology Development (RTD) group is looking for an experienced Dry Etch Technology Development Equipment Engineer to help enable the 3DxP and NAND technology development. As an NSG RTD Dry Etch TD Equipment Engineer, you would be responsible for multiple tool sets within the Dry Sector.

Your responsibilities would include:

  • Defining the Dry Etch equipment road maps to meet requirements, goals and milestones for a new technology process.

  • Defining and establishing equipment configurations and operating and qual procedures for the Dry Etch module equipment.

  • Working closely with the operations team and vendors to meet target tool availability.

  • Developing procedures for Dry Etch equipment maintenance and troubleshooting

  • Ensuring close interaction with tool vendors. Drive escalations and ensure resolution to any equipment problems.

  • Establishing process control systems for the etch equipment and drive activities to ensure target availability.

  • Providing application, planning, and scheduling support

  • Defining and executing new tool installations and qualifications

  • Optimizing existing tool performance and providing recipe application support for Dry Etch Technology Development Process Engineers and fab users.

Additional responsibilities include, but are not limited to:

  • Maintaining and developing/upgrading tool to meet uptime and cycle time requirements

  • Providing training to engineers, equipment maintenance technicians and gating certification

  • Managing and partnering with vendors to meet technology development needs

  • Working with technology development engineers to develop, prioritize, and manage projects

  • Ensuring proper documentation exists for the shift teams and Job Hazard Analysis are conducted

  • Improving tool availability, and finding solutions to ongoing problems

  • Identifying, quantifying, and qualifying cost reduction projects

  • Serving as the liaison between facilities, vendor reps, and shift personnel

  • Partnering with technology development to reduce line impact while addressing tool issues

  • Interacting with stakeholders to develop new hardware, software, and technology improvements

  • Identifying global BKMs and local golden tools to improve tools performance

  • Strive continuously to improve process module overall capability

Qualifications

Minimum Requirements:

  • PhD degree or Masters in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Material Science, Physics, or Chemistry with over 6 years of experience in the semiconductor industry.

  • 6 years of direct hands-on experience on Dry Etch equipment tool installation, qualification, matching and maintenance.

  • 6 years of experience in Statistical Process Control SPC or Design of Experiments DOE principles.

Preferred Requirements:

  • 10+ years of direct experience on Dry Etch equipment tool installation, qualification, matching and maintenance.

  • Good communication and stakeholder management skill.

  • Intermediate understanding of semiconductor equipment and processes.

  • Demonstrated data extraction, analysis, and reporting skills

  • Strong partnering and teamwork skills

  • Proven ability in multi-tasking complex projects

  • Proven ability to troubleshoot complex problems and address root causes

  • A fast learner to adapt to the culture and the technology

  • Demonstrated experience working with external and internal partner

  • Must be flexible in accommodating changing priorities and working hours to support business needs

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....