Intel Lab Engineer in Albuquerque, New Mexico

Job Description

Intel Non-Volatile Memory Solutions Group (NSG) 3DxP Technology Development Lab in Rio Rancho, NM is seeking applicants for Lab Engineer positions. Lab Engineers will be responsible for working with a team of engineers and technicians in an analytical lab environment to perform a variety of analyses to support Intel Non-Volatile Memory 3DxP technology development using various state-of-the-art analytical instruments. The lab areas include Analytical Chemistry, Scanning Electron Microscopy (SEM), Secondary Ion Mass Spectrometry (SIMS), Surface Analysis, Transmission Electron Microscopy (TEM), Electrical and Physical Failure Analysis. Your responsibilities will include but not be limited to:

  • Responsible for lab preparation for the new TD start up including lab tools install/qual, tool operation training and Intel 3DxP process driven analytical tools/techniques development

  • Responsible for lab daily operations including sample preparation, data collection and interpretation, customer interaction, tool calibration and other lab sustaining activities

  • Providing quality and timely lab support for the TD tool and process development, excursion response, low yield diagnosis and reliability requirement

  • Working in a skew'ed shift may be required (for some areas)

Qualifications

You should possess a Bachelor or a Master of Science degree or a Ph.D. in Material Science, Chemistry, Chemical Engineering, Physics, Computer Science, Electrical Engineering or equivalent experience and/or degree and/or background. Additional qualifications include:

  • Ability to demonstrate in-depth understanding of analytical equipment and semiconductor process flow operation

  • Good team player and be able to establish collaborative relationships with internal customers

  • Knowledge of basic statistics would be an added advantage

  • Lab experience with Inductively Coupled Plasma Mass Spectrometry (ICPMS), Scanning Electron Microscopy (SEM), Focused Ion Beam (FIB), Secondary Ion Mass Spectrometry (SIMS), Time-Of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS), X-ray Photoelectron Spectroscopy (XPS), X-ray Diffraction (XRD), Scanning Capacitance Microscopy (SCM), Transmission Electron Microscopy (TEM), Electrical Testing using Magnum tester and Fault Isolation using emission based techniques or similar would be highly desired.

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....