Intel 3D XPoint Product Development Engineer in Boise, Idaho
Intel is looking for a 3D XPoint Product Development Engineer that will be responsible for ensuring the testability and manufacturability of integrated circuits from the component feasibility stage through production ramp. This role makes significant contributions to design, development and validation of testability circuits.
Additional Responsibilities Include (but are not limited to)
Complete evaluation, development and debug of complex test methods.
Develop and debug complex software programs to convert design validation vectors and drive complex test equipment.
Create and test validation and production test hardware solutions.
Test, validate, modify, and redesign circuits to guarantee component margin to specification.
Analyze and evaluate component specification versus performance to ensure optimal match of component requirements with production equipment capability with specific emphasis on yield analysis and bin split capability.
Analyze early customer returns with emphasis on driving test hole closure activities.
Create and apply concepts for optimizing component production relative to both quality and cost constraints.
MS or PhD in Electrical Engineering
+1 years experience working with non-volatile memory component technology (examples include: Next Gen NVM memory/NAND/NOR/DRAM AND/OR CPU technology as a Product Engineer, Product QRE, Test Engineer, Design Engineer, or other similar job function).
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
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