Intel NVM Device Integration and Yield Engg in Boise, Idaho

Job Description

NonVolatile Memory Device and Integration engineers are responsible for leading research and development in order to architect, develop and deliver leading edge nonvolatile memory technologies to high volume manufacturing. They contribute to defining process and device architectures, technology collaterals as well as develop scaling paths for leading edge memory technologies. The scope includes development of new types of process and device architectures involving novel materials, structures and integration schemes to deliver industry leadership in density, performance, reliability and cost. They collaborate with technology development partners in defining goals, developing the vision, aligning strategy and driving fast paced silicon development to meet aggressive technology node cadences. In addition they work closely with the product and system teams to ensure seamless integration of the memory components into Intels system products as well as with the manufacturing Fabs to ensure a seamless technology transfer and ramp to support the full envelope of component and system products.

The ideal candidate should exhibit the following behavior skills:

  • Demonstrated proficiency in structured problem solving, proven track record of technical achievement/leadership

  • Ability to develop technologies in a cross disciplinary environment with good communication, presentation and interpersonal skills


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through school work, classes and project work, internships, military training, and/or work experience.

Minimum Qualifications:

Must have a Ph.D. degree in Electrical Engineering, Applied Physics, Material Science/Engineering or other related field.

6 (+) months of expertise in semiconductor device physics and scaling, semiconductor device processing and fabrication, and materials/device characterization techniques

Preferred Qualifications

Understanding of manufacturing yield, devices and materials reliability, design of experiments, statistics, device modeling, DFM and/or emerging technology awareness is a plus.

Work experience in the area of non-volatile memory is a plus but not required.

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.