Intel 3D Xpoint Memory Senior RnD Engineer in Folsom, California
We are looking for engineers that are excited to be part of one of Intel's fast growing teams, NSG Non-Volatile Memory Solutions Group. As a 3D Xpoint R&D Engineer in Probe Testing, you will be responsible for:
Ensuring the test-ability and making significant contributions to design, development and validation of 3D Xpoint Memory;
Evaluation, development and debug of complex test methods and metrologies to support R&D cycle of 3D Xpoint Memory;
Developing and debugging complex software programs to convert design validation vectors and drive complex ATE;
Creating and testing validation and production test hardware solutions;
Testing, validating, modifying and redesigning circuits to guarantee component margin to specification;
Analyzing and evaluating component specification versus performance to ensure optimal match of Memory component requirements with FAB equipment capability with specific emphasis on Yield analysis and bin split capability;
Creating and applying concepts for optimizing component production relative to both quality and cost constraint;
Autonomously plans and schedules own daily tasks, develops solutions to problems utilizing formal education and experienced judgment.
Willingness to travel approximately once per quarter.
You must possess the minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through school work, classes and project work, internships, military training, and/ or work experience. T his is an entry level position and will be compensated accordingly.
The candidate must possess a MS or PhD degree in Electrical or Computer Engineering, or similar degree.
Minimum 6 months of experience in the following:
non-volatile Memory components, product test, DFT and/or Research and Development for CMOS/Memory Technology/, or ATE development
C/C++ and embedded systems
Experience with FAB, Wafer Sort/Probe, Assembly, Test, and DFT/DFM/DFR;
Experience with NVM products and design validation, product R&D, qualification and L/HVM test;
Experience of device physics, circuits, statistics, and semiconductor characterization/fabrication process; with Memory/CPU/SoC testers and test code environment, specifically Wafer-Level testers
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
US, New Mexico, Albuquerque
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....