Intel 3D-XPoint Mixed Signal/Analog Design Intern in Folsom, California
An analog intern on the 3DXP design team will be responsible for pathfinding new solutions to reduce energy, power, latency, die size of 3DXP products and to develop solutions for new technology requirements. Once all paths have been identified, designers build and test schematics that meet all functionality and performance goals for the designated 3DXP products and develop methodologies and coverage metrics to ensure quality at the fullchip level. After design is complete, designers support fullchip validation by building various path and fullchip models and running extensive full chip validation suites while also working with layout to ensure cell level and block level layout is being drawn as necessary to achieve the desired performance and spec functionality. Finally, the designers work with product engineering to debug post silicon issues by developing models for observed behavior and proposing experiments both in silicon and in simulation to prove or disprove the proposed models.
You must possess the minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through school work, classes and project work, internships, military training, and/ or work experience.
The candidate must be pursuing a Master's degree in Electrical Engineering, Computer Engineering or a related discipline
Minimum 3 months experience in the following:
Analog and circuit design
CMOS semiconductor device physics and silicon processing
Transistor-level circuit simulation tools such as HSPICE
Experience using custom design environments such as Cadence Virtuoso
Knowledge of DRC, LVS, and post-layout extraction tools
Proficiency in UNIX and strong programming skills using C++, Perl, TCL, etc.
Experience in CMOS semiconductor device physics and silicon processing
Experience with transistor-level circuit simulation tools such as SPICE
Project work using device modeling tools such as hsim, Ultrasim, etc
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....