Intel 3DXP Memory Architect in Folsom, California

Job Description

3D XPoint Technology is a revolutionary new memory technology which is projected to transform the compute memory hierarchy as well as to blow away the performance of conventional storage solutions.

The 3DXP Component Design team is a small, tightly knit group of circuit and logic designers located in Folsom California who are dedicated to making this new technology successful. As a growing business within Intel, we can't afford to set artificial bounds on the responsibilities of folks on our team - so although everyone has primary job responsibilities, it's all hands on deck to solve problems and get the job done.

The 3DXP Component Design Team is currently looking for the right person to take a technical leadership role in the design and analysis of our array core architecture and algo development & functionality - someone who will seize the opportunity to work across functional teams that can span multiple locations to find ways to address performance and technology gaps that enable a path to meet the long term 3DXP program goals.

The key responsibilities of this person include the following:

1) Technical Leadership: There are plenty of challenges facing this new technology. As a technical leader on the team, this person will need to work with other key stakeholders across multiple disciplines to identify the most important design & technology challenges, understand all the relevant design capabilities, simulated expect behavior and observed data, and then help direct the team to find and execute the best solutions.

2) Excellent communication: Working on a new technology, much of the key learnings are happening on the fly and there is limited documentation. As a leader on the team, this person is expected to drive clarity across the organization by clearly communicating and summarizing problems, status, data, and proposals both orally and in writing such that others can more quickly come up to speed and get aligned.

3) Excellent teamwork: With a relatively small team, we need everyone to help out however and wherever they can. This means being flexible in assignment as dictated by program needs and may include direct or indirect supervision of junior team members or working independently. With the bulk of the design team located in Folsom, this will likely mean regular travel back and forth between sites until enough connectivity has been built to enable maximum output from Santa Clara.

4) Lead by example: This is a team which values doers and expects everyone to chip in to meet our deliverables. As a senior technical leader, this person will be expected to provide inputs and expertise wherever possible within the design team and to step up to lead the way out of whatever challenges the design team may face.

5) Eagerness to learn: Initially the focus will be on array functionality and algo optimization for the most recently developed products but ultimately expanding to whatever is necessary to help the 3DXP design team to succeed

Behavioral & technical skills for this position include the following:

1) Excellent experience in memory array design and architecture

2) Strong background in nonvolatile memory support circuits that enable addressing, power management, reference generation & distribution, and current control

3) Ability to thrive in a highly cross functional and collaborative environment

4) Excellent written and verbal communication

5) Demonstrated ability to lead technical development


1) MSEE with 12+ years or BSEE with 15+ years of prior Nonvolatile Memory Design experience

2) Knowledge of Cadence schematic & layout tool suit and Spice/FastSpice simulation tools

3) Knowledge of design model building and validation methodologies

4) Some experience building teams, managing projects, developing employees

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....