Intel 3DXP Product Development Engineer in Folsom, California

Job Description

Come join Memory Component Development (MCD) organization within Intel’s Non-Volatile Memory Solutions Group (NSG) as Product Development Engineer on 3D cross point memory technology. In this role, you will be expected to be a part of and participate in global PDE team responsible for all aspects of product development engineering in a start-up like environment, to enable Intel's product roadmap in data center and client product segments.

* THIS IS AN ENTRY LEVEL POSITION *

In this role your responsibilities will include but not be limited to:

  • Responsible for ensuring the testability and manufacturability of integrated circuits from the component feasibility stage through production ramp.

  • Make significant contributions to design, development and validation of testability circuits. Evaluation, development and debug of complex test methods.

  • Develops and debugs complex software programs to convert design validation vectors and drive complex test equipment.

  • Creates and tests validation and production test hardware solutions.

  • Tests, validates, modifies and re-designs circuits to guarantee component margin to specification.

  • Analyzes and evaluates component specification versus performance to ensure optimal match of component requirements with production equipment capability with specific emphasis on yield analysis and bin split capability.

  • Analyzes early customer returns with emphasis on driving test hole closure activities. Creates and applies concepts for optimizing component production relative to both quality and cost constraints.

  • Autonomously plans and schedules own daily tasks, develops solutions to problems utilizing formal education and judgment.

The candidate should possess the below behavioral traits:

  • Fast-learner with a disciplined and methodical approach to execution

  • Dive deep into understanding technical details of the problem and willing to ask for and accept help upon hitting roadblocks, in order to make progress

  • Problem solving with sound logical thinking and analysis

  • Communication and articulation skills, both verbal and written

  • Team player, yet capable of independently executing to assigned tasks

  • Keen attention to details

Qualifications

You must possess the minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through school work, classes and project work, internships, military training, and/ or work experience. This is an entry level position and will be compensated accordingly.

Minimum Requirements:

  • The candidate must possess a Bachelor of Science degree in Electrical Engineering/Computer Engineering/Computer Science

  • This U.S. position is open to U.S. Workers Only. A U.S. Worker is someone who is either a U.S. Citizen, U.S. National, U.S. Lawful Permanent Resident, or a person granted Refugee or Asylum status by the U.S. Government. Intel will not sponsor a foreign national for this position.”

Minimum 6 months of experience in the following:

  • software background & programming skills C++, Perl, Python, any scripting language

  • semiconductor device physics, fundamentals of testing, digital electronics principles, microprocessor basics

  • memory hierarchy and physical structure of memory devices, basics of VLSI design, assembly language programming, computer architecture, data structures, and statistical data analysis.

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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