Intel CMOS Reliability R and D Engineer in Folsom, California

Job Description

In this position, you will be working as a member of the Non-Volatile Memory (NVM) Solutions Group's (NSG's) Technology Development Quality and Reliability team, helping to develop Intel’s new emerging NVM technologies (such as 3D NAND and 3D XPointTM) and SSD products, focusing on CMOS transistor reliability. Your responsibilities will include but not limited to:

  • Characterizing CMOS device and interconnect FEOL and BEOL reliability

  • Developing transistor aging models aiming to ensure proactive product design for high reliability

  • Determining reliability requirements and technology targets of components to achieve company, customer and other reliability objectives

  • Developing empirical and physics-based predictive reliability modeling methods and tools for reliability risk assessments

  • Developing new acceleration techniques, test methods and analytical tools to provide fast and effective feedback for process, product and test optimization on reliability issues

  • Influencing design, process, product, test and/or system solutions in order to enable aggressive scaling of Intel's NVM technologies

  • Developing the appropriate process- and product-qualification stress methods and criteria

You may be expected to lead small cross-functional and cross-company groups of engineers on multi-disciplinary technical projects to solve complex reliability issues- such as, during technology development and ramp to high-volume manufacturing. You may also be expected to supervise a small team of engineers and/or technicians.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

-You must have a Ph.D. degree in Electrical Engineering, Physics, Materials Science, or Computer Engineering.

  • Solid understanding of semiconductor device physics, materials science, probability and statistics, circuit design, semiconductor processing, and quantum physics

  • 3+ years of experience outside academia relevant to CMOS device and interconnect FEOL and BEOL reliability, including:

Technical skills:

  • 3+ years of experience in CMOS transistor reliability physics (TDDB, HCI, NBTI, PBTI), intermetal dielectric reliability and EM

  • 3+ years of experience in reliability aging models and simulation for circuit reliability assessments

  • 3+ years of experience in transistor device modeling, characterization and parameter extraction such as BSIM

  • 3+ years of experience with reliability failure statistics, physics, or reliability failure mechanisms

  • 3+ years of experience with test equipment such as semiconductor parametric analyzer CV-IV, pulse generators, oscilloscopes, etc. for electrical characterization of electronic materials and devices

  • 3+ years of experience of computer programming for testing, and data acquisition, reduction and analysis (C or C++, Perl, Python, LabVIEW)

  • 3+ years of experience with statistical analysis packages (e.g. R, JMP or Minitab)

  • Knowledge of semiconductor fabrication process, CMOS transistor level circuit design, packaging assembly, test and/or board/system level technology operation

Performance skills:

  • Demonstrated leadership to assume the authority, energize teams and advocate for new ideas

  • Demonstrated ability to work in a fast-paced dynamic environment

  • Demonstrated persistence and commitment to achieving results

  • Ability to clearly communicate achieved results and to influence wide range of audiences

  • Ability to work well in a team setting with people from a wide range of backgrounds

  • Ability to understand the high level picture and apply systems thinking to generate solutions

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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