Intel Component Packaging Development Engineer in Folsom, California

Job Description

The NVM Solutions Group NSG is seeking a Component Packaging Development Engineer for the development of Non-Volatile Memory discrete package components. In this role you will coordinate, interact, and communicate with fab TD team, fab factory, Intel Asia assembly team, QRE, planning and Intel Product Development Team PDT to integrate next generation silicon into assembly packaging technology. The candidate will be an interface between fab and assembly teams to create assembly test chip definition, provide silicon/packaging assembly and reliability risk assessment, manage assembly site to evaluate silicon packaging interaction, and define risk mitigation plan to reduce silicon packaging integration risk. This role also provides opportunity for support of early silicon integration path finding programs.



  • Bachelor + 7 years or MS/Ph.D. in an engineering field with focus on silicon design/fab process development

Minimum Requirements:

  • Minimum of 3 years of experience in silicon design or fab process

  • Minimum of 2 years of experience of packaging/assembly interaction and failure mechanism analysis

  • Minimum of 2 years of experience of working with modeling team to assess silicon packaging interaction risks

Preferred S kills:

  • Program management leadership and technical problem solving skills.

  • Knowledge of Si fab back end/far back end material/process and Si/packaging interaction.

Additional Required Skills:

  • Ability to work in a fast paced environment while managing changing priorities.

  • Strong written and verbal communication skills.

  • Flexibility in working with Asia and US time zones.

  • Flexibility and ability to cope with and resolve ambiguity.

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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