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Job Information

Intel Packaging R&D Engineer in Folsom, California

Job Description

Microelectronic Packaging Engineers:

  • Provides project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

  • Are responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design

  • Conducts tests and research on basic materials and properties

  • Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance

  • Provides consultation concerning packaging problems and improvements in the packaging process

  • Responds to customer/client requests or events as they occur

  • Develops solutions to problems utilizing formal education and judgment

Qualifications

Education:

  • BS/MS in Mechanical Engineering, Material Science or similar degree

Minimum Requirements:

  • 1-3+ years’ experience with Semiconductor Packaging

  • 1-3+ years’ experience in Program and Supplier Management skills

  • 1-3+ years’ experience in physical failure analysis

Additional Required skills

  • Accountability, credibility with peers, management, stakeholders, and customers

  • Ability to drive results across organizational boundaries by leading cross-functional teams

  • Self-motivated, able to adapt to change and able to operate with limited supervision in an ambiguous environment

Preferred Skills:

  • Knowledge of physical Failure Analysis tools and equipment

  • Able to analyze and interpret cross-sections, x-ray, lapping results

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....

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