Intel Device Reliability lab Engineer - Silicon Photonics in Hillsboro, Oregon
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor device research, process development and manufacturing, through yield improvement, to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of Intel's worldwide network of manufacturing and assembly/test facilities. As a member of this team you will be joining Stress Engineering & Operation SEO, which is part of Corporate Quality Network CQN, Intel's corporate-wide Quality and Reliability organization. SEO is a small, professional and dedicated team which works independently and in conjunction with Technology Development Quality and Reliability TD Q&R and product development teams across Intel to develop and implement new reliability stress capabilities which are needed for the development and certification of Intel's most advanced process technologies.
Our stress labs are located in the Intel's Ronler Acres Campus in Hillsboro, OR, at the outskirts of Portland in the beautiful pacific North West. Silicon photonic SiPH is a growing business in Intel where we develop state of the art photonic based devices for Intel's current and future products. In this role you will be working closely with both the fab and product reliability teams and be the point of contact for SiPH package assembly and stress board design for reliability data collection. Helping to collect burn-in and environmental data.
The ideal candidate should exhibit the following behavioral traits:
-Ability for systematic analytical problem solving.
-Demonstrated project management skills
-Demonstrated attention to details and quality of work.
-Demonstrated persistence and commitment to task.
-Ability to clearly communicate achieved results and to influence wide range of audiences.
-Ability to understand the high level picture and apply systems thinking to generate solutions.
-Demonstrated creativity and innovation in solving technical problems.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through school work, classes and project work, internships, military training, and/or work experience. This is an entry level position and will be compensated accordingly.
Candidate must possess a Master of Science or Ph.D. degree in Electrical Engineering, Physics or related field.
Minimum 6 months of experience with:
-Wire bonding, wafer saw and assembly process.
-Silicon Photonics physics or device physics.
-Programming languages e.g. C or C++, Matlab, PERL or Python and scripting skills.
-Computer programming for testing, and data acquisition, reduction and analysis.
-Circuits test or validation.
-Experience with probability and statistics, circuit design, semiconductor/SiPH processing.
-Hands-on experimental design, execution, analysis, interpretation and synthesis.
-Experience with statistical analysis.
-Experience with packages is a bonus e.g. R, JMP or Minitab
-Knowledge of semiconductor fabrication process, packaging assembly.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
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