Intel Failure Analysis Intern in Hillsboro, Oregon

Job Description

Come intern with Intel's Corporate Quality Network (CQN) within in the BLIFA-ATTD FA Labs team. Responsibilities may be quite diverse in a technical nature and will vary significantly depending on the unique needs of the role, U.S. experience and education requirements. Job assignments may be for the summer or for short periods throughout the school year. Candidate must be willing to work in Failure Analysis Lab environment; developing methods for next generation products using various tools (microscopy, solder rework/reball tool etc).

The responsibilities will include, but are not limited to the following:

  • Develop techniques to rework and reball next generation products using various tools (microscopy, solder rework/reball tool etc).

  • Support ad-hoc projects and operations

The ideal candidate should exhibit the following behavioral traits:

  • Problem-solving skills

  • Ability to multitask

  • Strong written and verbal communication skills

  • Ability to work in a dynamic and team oriented environment


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through school work, classes and project work, internships, military training, and/or work experience.

Minimum Qualifications

  • Must be pursuing a BS Materials Science, Chemical Engineering, Mechanical Engineering or any related field

  • Minimum of 3 months of experience using microscopes, fundamentals of solder metallurgy

  • This U.S. position is open to U.S. Workers Only. A U.S. Worker is someone who is either a U.S. Citizen, U.S. National, U.S. Lawful Permanent Resident, or a person granted Refugee or Asylum status by the U.S. Government. Intel will not sponsor a foreign national for this position.

Preferred Qualifications:

  • Familiarity with solder metallurgy, solder re flow methods

  • Exposure to analytical tools like optical microscopy, scanning electron microscope, solder-ball rework and re-ball etc

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....