Intel FI Discipline Engineer in Hillsboro, Oregon
The engineer will support and lead projects involving semiconductor fabrication facilities, support buildings, process equipment, and related systems. During these projects this individual will oversee technical design execution, scope creation, data collection, and budget estimation. In addition, the individual will act as a customer engineering representative for Intel. As a representative, this person will interface with a number of internal Intel organizations, equipment suppliers, architectural and engineering firms, and other entities to enable design and construction of Intel equipment and facilities. The individual will also be assigned to a specific process area (Lithography, Etch, Diffusion, etc.) to act as a single point of contact for new engineering and design activities in that area.
Additional responsibilities include but are not limited to:
Driving consistency in facility and equipment installation processes across Intel’s factories.
Developing and overseeing execution of engineering processes on a global scale.
Working with equipment suppliers to drive optimal equipment design and minimize construction and utility usage.
The ideal candidate should exhibit the following behavioral traits:
Verbal, written, and presentation skills to convey technical information to a variety of personnel, both internal and external to Intel.
Capability to facilitate a teamwork environment.
This is an entry level position and will be compensated accordingly.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Must have a Master's degree in Electrical, Mechanical or Aerospace Engineering.
3+ months of experience with engineering methods and design principles to ensure analyzed content is both feasible and constructible.
Experience/Knowledge of Power Analysis/Systems and energy delivery.
Experience in creating/executing engineering processes
Experience with 2D or 3D Modeling Software (AutoCAD, Inventor, SolidWorks)
Applicable engineering experience in facility/equipment design.
Passing score on Fundamentals of Engineering Exam.
Project management experience
Ability to document and explain design and scope content to both technical and non-technical team members.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....