Intel Packaging R&D Engineer in Hillsboro, Oregon

Job Description

Microelectronic Packaging R&D Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor processes. Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Drive improvements on process quality, reliability, stability, capability to ensure process is transferable to High Volume sites. Conducts tests and research on basic materials and properties. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.

In this role, you will be joining the Die Preparation Technology Development group as part of Assembly Technology Development. This group is responsible for all of 300MM Development programs, supporting current technologies and building new capabilities in the future for advance packaging.

The ideal candidate should exhibit the following behavioral traits:

  • Systematic problem solving skills combined with effective presentation of complex concepts and solutions

  • Experienced technical leadership to guide concepts from theory to solutions while building rapport with other internal teams and suppliers

  • Ability to work well in ambiguous situations

  • Ability to work well in teams

This is an entry level position and would be compensated accordingly .


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

Posses a Ph.D. in Sciences, Materials Science, Chemical Engineering, Mechanical Engineering or related engineering disciplines.

Preferred Qualifications:

Candidate has 6 + months of work or educational experience in the following:

  • Possess prior clean room/manufacturing experience and knowledge of semiconductor material processing

  • Knowledge of design of experiments, statistical methods, statistics, and FMEA.

  • Knowledge of Mechanics of materials (solid/thermal/fluid)

  • Prior experience in Intel technology development

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.