Intel Process TD Engineer Intern in Hillsboro, Oregon
Intel's assembly technology development team is looking for engineers to develop innovative board and system assembly solutions to prepare customers for production of Intel's next generation product lines.
The role may entail process and equipment development supporting 1) certification of Intel next gen packaging solutions and 2) assembly of prototypes of next generation Intel products. Other aspects of the internship project may include defining and establishing process flow, procedures, and equipment configuration for a process module within the printed circuit board assembly manufacturing development line. Additional roles include developing material, tooling, fixtures, and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements. The intern will work with product engineers and the new package platform owners to plan and conduct experiments to fully characterize the process throughout the development cycle. The intern may also be involved in driving improvements on yield, process stability/capability (PCS), productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Also, is be expected to develop solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools.
The ideal candidate will have an understanding of surface mount technologies to assemble printed circuit boards, which utilizes processes related to solder paste screen printing, component placement, SMT reflow, wave solder and test. The role requires use of FMEA, SPC, statistical methods, and data analysis methods.
And also should exhibit the following behavioral traits:
Strong and excellent communication skills.
Detail orientation skills.
Ability to work across multi culture and/or multi geography.
Strong interpersonal skills.
Technical leadership and problem solving skills
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
- Be pursuing an M.S. or PhD in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Material Science, or related discipline.
- Engineering work experience in manufacturing and/or circuit board assembling technology development (TD) is desired.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....