Intel Process TD Engineer in Hillsboro, Oregon
The role entails process and equipment development to 1) certify Intel next gen packaging solutions and 2) assemble prototypes of next generation Intel products. Defines and establishes flow, procedures, and equipment configuration for the printed circuit board assembly manufacturing module. Selects and develops material, tooling, fixtures, and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Works with product engineers and the new package platform owners to plan and conduct experiments to fully characterize the process throughout the development cycle. Drives improvements on yield, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Establishes process control systems such as SPC methods for the manufacturing module. Trains production and partner site process engineers for transfer to other factories.
This is an entry level position and would be compensated accordingly .
The ideal candidate should exhibit the following behavioral traits:
Communication , teamwork, problem solving and detail orientation skills.
Ability to work across multi culture and/or multi geography
Technical leadership and problem solving skills
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
Posses a Masters of Science or Ph.D. degree in Mechanical Engineering, Material Science, or related discipline.
Minimum of 6 months of work experience with/using of FMEA, SPC, statistical methods, and data analysis methods.
Minimum of 1 year of work experience the following areas:
Manufacturing and/or circuit board assembling technology development (TD)
Understanding of surface mount technologies to assemble printed circuit boards, which utilizes processes related to solder paste screen printing, component placement, SMT reflow, wave solder and test.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....