Intel Si Packaging Engineer in Hillsboro, Oregon

Job Description

As Package design lead, you will be responsible for the following:

  • Executing PKG designs across Intel's Server product portfolios (CPUs, Chipsets, SOC designs and more).

  • Directing technical aspects of the Package design process including conducting early route studies, creation of specifications, providing guidance for electrical analysis and supervision of production layouts.

  • Managing design schedules, conducting design reviews and guide in package tape out process.

  • Work closely with other stakeholders from different organizations within the company to incorporate their inputs into the PKG design.

You should also exhibit the following behaviors skills:

  • Proven Team player

  • Communication and stakeholder management skills


You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

This is an entry level position and will be compensated accordingly.

Minimum Qualifications:

  • Must have a Bachelors or Master's in Electrical, Mechanical/Thermal Engineering, Materials Science or related disciplines. Candidates with Bachelors should have 3+ years of packaging Industry experience.

  • Prior experience/exposure with physical design (Package/PCB) is preferred

Additional Preferred Qualifications :

  • Experience/Exposure in Package/Substrate technology development

  • Familiarity with PKG design tools like Auto CAD, Cadence and/or Mentor Graphics

  • Familiarity with Package layout extraction and Electrical modeling/simulation tools such as PowerDC, Hyperlynx, Q3D, and HFSS

  • Interest in scripting languages such as Perl, VB

Inside this Business Group

The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

Other Locations

US, Arizona, Phoenix;US, California, Santa Clara

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....