Intel Thermal Engineer in Hillsboro, Oregon

Job Description

Come and join us! Intel is seeking highly qualified candidates to join our Data Center Group (DCG) team as a Thermal Engineer!

In this position, you will be a member of the Systems and Components Division SCD team in Datacenter Engineering Group DEG. With a strong technical background in thermal engineering, you will be responsible for working with the silicon teams to deliver thermally optimized CPU silicon. You will be working on advanced cooling technologies required to meet the thermal challenges of server CPU package components. As a key contributor in the system development process, you will work closely with system thermal and mechanical architects, board engineers, component mechanical engineers and server power/thermal management teams. You will be responsible for establishing CPU thermal specification, developing reference thermal solutions and evaluate any design tradeoffs. As part of the product development, the thermal engineer will also be responsible for qualifying the cooling solution designs to the Intel's thermal requirements.

In this position you will gain invaluable experience which will allow growth and expanded opportunities within this business group as well as future possible opportunities with other business groups within Intel.

The Data Center Group (DCG) drives new products technologies from high-end co-processors for supercomputers to low-energy systems for enterprise and the cloud, as well as solutions for big data and intelligent devices. The group is a worldwide organization that develops the products and technologies that power nine of every 10 servers sold worldwide.

www.intel.com/jobs/datacenter

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Required Qualifications:

Bachelor Degree in Mechanical Engineering or related discipline with 4+ years of work experience or a Master’s Degree in Mechanical Engineering or related discipline with 3+ years of work experience.

  • 4 plus years of experience working with heat transfer fundamentals as they apply to electronics cooling.

  • 4 plus years of experience working with thermal simulation software such as Flotherm* or Icepak*.

  • 4 plus years of experience with hands-on knowledge of thermal design/testing techniques.

Additional Preferred Qualifications:

  • Prior experience with the architecture of server systems and components.

  • A working knowledge of MATLAB, Labview and statistical methodologies such as Monte-Carlo* simulation.

  • Familiarity with fundamental electrical engineering principles.

  • Good interpersonal, communication, problem solving and analytical skills.

  • Ability to work independently in a fast-paced environment.

Inside this Business Group

The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

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