Intel 3DxP Process Integration Manager in Lehi, Utah
Intel's 3D Cross Point Memory 3DxP is a new breakthrough in non-volatile memory technology and is revolutionizing the NVM landscape and storage/memory as we know it. This is one of the key pillars for NSG and Intel's growth strategy and the team is still in their forming phase and it’s not too late to get in as the team expands.
The Technology Development team is looking for a senior and experienced Integration leader with strong leadership skills to lead the process integration team. Candidate will need strong leadership and influence skills. This position will require flexibility to accommodate the changing priorities and needs in a technology development environment involving brand new materials, architecture, and integration schemes.
The Intel Micron Joint Venture IM Flash Technologies Fab in Lehi, Utah plays a key role in the success of this technology to rapidly introduce, ramp, and enhance the Si process capability to meet the performance, yield, and cost goals for NSG.
MS or PhD degree in Computer Science, Electrical Engineering, Chemical Engineering, Material Science, Physics or Chemistry.
Experience in Silicon integration technology development.
Demonstrated experience working with external and internal partners.
Must be flexible in accommodating changing priorities to support business needs.
The right candidate will be a fast learner and will need to quickly become an expert in the systems, tools, automation, data extraction, analysis and business processes.
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
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