Intel Package Design Engineer in Phoenix, Arizona

Job Description

As Package design lead, the successful candidate would be responsible for executing Package product designs. He/She will be enabling technical aspects of the Package design process including conducting early route studies, creation of specifications, providing guidance for electrical analysis and design layouts. Job function also involves managing design schedules, conducting design reviews and guide in package tape out process. As Package design lead, the candidate will also work closely with other stakeholders from different organizations within the company to incorporate their inputs into the PKG design.

The ideal candidate should exhibit the following behavioral traits:

  • Proven Team player.

  • Strong communication and stakeholder management skills.

This is entry level position and will be compensated accordingly.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

  • Posses a Bachelor or Master's in Electrical or Mechanical Engineering.

  • 1 +year of experience in the following areas:

  • PKG design tools like Auto CAD, Cadence and/or Mentor Graphics

  • Package layout extraction and Electrical modeling/simulation tools such as PowerDC, Hyperlynx, Q3D, and HFSS

Preferred Qualifications:

  • Experience in Package/Substrate technology development

  • Interest in scripting languages such as Perl, VB

  • Prior experience/exposure with physical design (Package/PCB

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....