Intel Package Failure Analysis Engineer, Intern in Phoenix, Arizona
Join Intel-and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. So join us-and help us create the next generation of technologies that will shape the future for decades to come. The Corporate and Quality Network is looking for an undergrad intern. Responsibilities and duties include but are not be limited to:
Metallography sample preparation involves planar/cross-section polishing and ion milling.
Perform imaging data collection and analysis including CSAM, X-ray, SEM imaging. Statistical SEM/EDS analysis on bimetallic intermetallic compound grain size and elemental analysis.
Work with Physical Failure Analysis teams on packaging failure mechanisms summarize FA report and findings and communicate the results / conclusion to customers.
The ideal candidate will exhibit the following behavioral traits:
Strong analytical problem solving, team work, effective oral and written communication skills.
Passionate in hands-on, lab-oriented environment.
Ability to work well in ambiguous situations.
Mature, self-assured, well organized.
You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences
- The candidate must be pursuing a Bachelor degree in Material Science, Chemical Engineering, or related areas
Knowledge on metallic alloy
Hands on experience in analytical lab
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
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