Intel Package Quality and Reliability Engineer in Phoenix, Arizona
As a Quality and Reliability engineer, you'll join a team developing leading edge semiconductor package technologies for Intel's latest products. We use a wide variety of skills, from analytical models to advanced experimental designs to extensive data analysis, to evaluate and improve the package technology. Together with our technology development partners, we find the root cause of failure mechanisms and devise solutions. We measure our success by delivering world-class quality on cutting edge package technologies, faster and at a competitive cost.
Set reliability requirements for next generation package technologies based on customer use conditions.
Influence new package technology design, process and material decisions based on fundamental technical knowledge.
Design test vehicles to isolate failure mechanisms and the root causes.
Innovate analytical and experimental methods to validate package technology reliability.
Deliver analysis results and impact to multiple levels within the quality and reliability community and business partners.
Successful candidates will have a track record of innovative problem solving, technical excellence, influencing stakeholders to win-win outcomes, great communication and balancing multiple priorities to meet deadlines.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through school work, classes and project work, internships, military training, and/or work experience. This is an entry level position and will be compensated accordingly.
Candidate must possess a Master’s degree in Mechanical Engineering, Material Science, Physics, Chemical Engineering, Chemistry or Electrical Engineering.
Minimum six months hands on experience characterizing mechanical or electrical properties of materials.
Minimum three months experience with large empirical datasets using statistical analysis, including addressing challenges with incomplete data.
One or more positions leading cross-functional project teams.
Experience in semiconductor fabrication process, packaging assembly, automated test and/or board system technology operations
Experience with mechanical testing, accelerated environmental testing, reliability testing and standards.
Experience in empirical data collection and statistical data analysis, reliability statistics, and design of experiments.
Proficiency with any of the following imaging and analytical lab techniques: such as acoustic imaging, and x-ray imaging, SEM, EDX, TEM, FTIR, TMA, DMA, DSC, TGA, SIMS and mechanical testing machines.
Basic programming or scripting for data analysis such as SQL PF, Python.
Experience with statistical software, JMP, MATLAB, Excel Macros.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
US, Oregon, Hillsboro
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.