Intel Packaging R&D Engineer (LYA Engineer) in Phoenix, Arizona
Low Yield Analysis (LYA) engineers are responsible for process and defect characterization as well as end-of-line electrical test fail analysis of the substrate and assembly process and identifying key mechanisms that contribute to ultimate root cause identification. Engineers will be expected to conduct hands on lab work, define data acquisition strategies and data analysis plans, and recommend corrective actions/fixes to internal customers. The LYA engineer will utilize strong presentation skills to influence individual process engineers as well as platform teams. Analysis will include both physical failure analysis (FA) and electrical fault isolation (FI) collection. The LYA engineer will also interact with a large team of technicians and provide guidance and mentoring on a wide variety of FI/FA methods and strategies. Other duties may include process and defect characterization and developing innovative techniques/approaches to accelerate failure identification and root cause mechanism understanding. LYA engineers will be expected to provide consultation concerning packaging/assembly challenges and work with partner organizations towards improvements in the manufacturing process. The ability to rapidly respond to customer requests or events as they occur while developing solutions utilizing formal education and engineering judgment is anticipated.
You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship.
This is an entry level position and will be compensated accordingly.
- Candidate must posses a MS in Material Science, Mechanical Engineering, Chemistry, Physics, Chemical Engineering, Electrical Engineering or other relevant applied engineering degree.
Minimum of 6 months of experience in optical microscopy, microscopy techniques (FESEM, CSAM, AFM, TEM/STEM), analytical techniques (FTIR, Raman, XRF, TXRF, Ellipsometry), crystallographic techniques (EBSD, XRD) and fracture analysis.
Minimum of 6 months of experience with sample preparation such as: mechanical cross-sectioning, planar grinding, ion milling, microtome and FIB.
Minimum of 6 months of experience in electrical fault isolation techniques: Curve trace, electrical Hand-probing, EBIC, IBIC, TIVA, LIVA, TDR, EOTPR, SQUID, SSM, ELITE.
Minimum of 6 months of experience with statistical data analysis, JMP and JSL, Python, and relational database structure as well as familiarity with commonality analysis.
Minimum of 6 months of experience in assembly process and/or relevant work or educational experience in characterization, failure analysis (FA), electrical test, or quality & reliability (Q&R) is a plus.
Willingness to work a compressed work week in a day Shift.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....