Intel SPTD Packaging R&D Engineer in Phoenix, Arizona
SPTD Laser Area is looking for a Packaging R&D Engineer to join the team in support of next generation substrate and packaging technology development. The responsibility of the individual is to foster and champion core packaging technology solution development covering the whole life cycle. The Packaging R&D Engineer will be involved in defining and maintaining the technology roadmap in the area of ownership, driving the equipment and/or materials suppliers' technology roadmap to meet Intel future demands. the Packaging R&D Engineer owns bringing the tools to R&D sites and qualifying the tools to meet production requirements. Is expected to plan sequence of operations and develop procedures and recipes for new tools and processes, exercising judgment and compromising between conflicting requirements, meeting technology, cost and manufacturability goals. The Packaging R&D Engineer also owns sustaining of the tools in charge to ensure process health, providing tech support to troubleshoot process and tool excursions in a timely manner to ensure minimal disruption to production. Will need to be able to collaborate smoothly with peers and various support teams to accomplish the above mentioned job functions.
This is an entry level positions and will be compensated accordingly.
The ideal candidate should exhibit the ideal behavioral traits:
Problem solving skills and capabilities.
Capability to combine sound engineering judgement and data analysis skills to draw conclusions,
Build models and design experiments.
Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
- Possess a Ph.D. in Materials Science and Engineering, Mechanical engineering, Chemical Engineering, or other applied engineering field.
Minimum of 6 months of experience in the following areas
Materials science and engineering (polymers, composites, metals and ceramics), and in material characterization techniques such as SEM, TEM, FTIR, XPS, AFM, XRD, etc.
Design of experiments, statistical data analysis, and statistical process control.
Industrial laser systems, laser micro-machining and micro-fabrication is preferred.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....