Intel SPTD Pathfinding Engineer in Phoenix, Arizona
Packaging R&D Engineer defines and establishes process flow, procedures, and roadmaps for package substrate development. Responsibilities include:
Development of laser via, lithography, or metallization process for microelectronic package substrate to meet quality, reliability, cost, yield, productivity, and manufacturing requirements.
Innovating, problem solving, developing, and continuously improving patterning / metallization manufacturing processes for microelectronic package substrate.
Research and benchmark of microelectronic packaging process, chemistry, and equipment to develop next generation laser, lithography, or metallization technologies in support of Intel's product roadmap.
Providing project management, process design/development, and sustaining support for IC substrate pathfinding and technology development.
Interacting with substrate and equipment suppliers, and international travel is required for project management and technical discussions with suppliers.
This an entry level position compensated accordingly
The ideal candidate should also exhibit the following behavioral traits:
Communication skills, and ability to work with diverse groups of engineers in highly matrixed project teams.
Availability to travel, tolerance of ambiguity, and personal flexibility related to the dynamic nature of project scope.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
Possess a PhD in Optical Engineering, Chemistry, Chemical Engineering, Materials Science, Mechanical Engineering, Physics, or relevant engineering disciplines.
Minimum of 6 months of experience in one or more of following fields: laser material processing, laser micromachining, laser via drilling, laser-materials interaction, lithographic patterning, materials microstructure, thermal mechanical properties of materials (polymers, composites, metals and ceramics), metal electrochemical plating, electrochemical etching, and chemical etching.
Minimum of 6 months of experience with 3 materials characterization techniques such as SEM, AFM, XPS, TEM, FTIR, EDX.
- Minimum of 6 months of experience in optics, laser engineering, laser beam steering and shaping, thermal analysis, and critical dimension characterization.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....