Intel SPTD Pathfinding Intern 2019 in Phoenix, Arizona

Job Description

Substrate Packaging Technology Development (SPTD) is looking to hire an engineer to join a team tasked with developing and ramping advanced organic substrate and packaging technologies via an internal pathfinding, technology development, and low volume manufacturing line. As a Packaging R&D Intern in the Pathfinding team, your internship involves fabrication of very high aspect ratio structures by working with litho, plating, dry and wet etch engineering teams. The project scope includes conducting various lab scale experiments to determine optimum integrated process window for delivering electrically functional coupons. This is a 'hands-on' position and will require a significant amount of time spent on the factory floor to develop new process technology and characterization of new materials. Since this will involve startup of new manufacturing capability for Intel, a high tolerance of ambiguity and flexibility with respect to job roles is desired.

The ideal candidate should exhibit the following behavioral traits :

  • Strong interest in hands-on work in the lab

  • Solid theoretical and practical understanding in materials characterization

  • Excellent listening, written and verbal communication skills

  • Demonstrated problem solving and analytical skills

  • Demonstrated capability of working and excelling in a high performing team environment

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

  • Be pursuing a PhD in Materials Science, Electrical Engineering, Chemical Engineering or Chemistry.

Preferred Qualifications:

  • Experience in semiconductor fabrication processes such as lithography, etch, thin films, plating, CMP is preferred.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....