Intel Multi chip package architect in Santa Clara, California

Job Description

The ever increasing requirement for bandwidth driven by the growth of large Data Centers to support 5G networks, automated driving cars and service scaling are creating technology demands which standard optical networks are struggling to address. Tighter integration of Silicon Photonics optical interfaces with advanced ASICs have the promise to address these technology challenges and create a new network paradigm. This critical work is driven through the Silicon Photonics Products Division as part of the Connectivity Group within the Data Center Group at Intel and pulls on broad range of disciplines supported by partners across Intel. We are looking for an experienced multi-chip packaging lead who has the passion to help drive lead this effort. The person should be a hands-on technologist across all aspects of packaging and will be able to lead and direct a matrixed team across multiple disciplines to address the technology challenges.Specific responsibilities include: Investigate and recommend the optimum package bonding processes for Intel's ASIC/photonic packageIdentify and manage partners in the design and manufacturing of packagingCoordinate thermal and mechanical stresses in prospective package designs, as well as help to evaluate reliabilityDirect activities of the layout of the package substratesCoordinate prototype package activities to quickly evaluate feasibility of the various approaches, and incorporate that learning into the designCoordinate with suppliers, process engineers and contract manufacturers to define the process flow and ensure manufacturability of the designManage prototype builds: Create bill of materials, identify suppliers, plan and manage the build scheduleDrive mechanical, thermal and electrical measurements to prove the performance of the components and assemblyDrive continuous improvements in the design and process

Qualifications

To succeed in this leadership role requires strong leadership and decision-making skills and the ability to build respect and influence across a diverse, cross-organizational team. The successful candidate will have excellent communication skills, and a passion for this challenge. The ideal candidate will have the skills described here:MSc or PhD in Physics with , or BSc and 5+ or more years of experience Experience in the design and reliability of flip-chip packagesSimulation and analysis of thermal and mechanical stressesA demonstrated track-record of successful design and transfer to manufacturing of IC packages under tight timelines Exceptional communication skills and the ability to influence other technical leaders Collaborative team player, who can motivate and focus the team to execute with speed and qualityRole model of accountability, possessing excellent teamwork skills, demonstrated innovative problem solving Make and facilitate decisive decision making under time pressureExperience with optical products is a plus

Inside this Business Group

The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.