Intel Optical Design Lead in Santa Clara, California
As an Optical Design Lead/manager, you'll be part of Intel's Silicon Photonics team that is leading the 400G-market transition and driving innovation for next generation of optical interconnect products. You will collaborate with multiple teams to develop the product that meets or exceeds product requirements. In this role, your responsibilities will include, but not be limited to the following:
Lead or support as a part of team in developing packaging design for state of the art Silicon Photonics SiPh devices and assemblies, with emphasis on optoelectronic and microelectronic component and sub-systems.
Drive and lead package designs and technology selection by assessing and mitigating risks associated with the product designs.
Partner with stakeholders to identify new suppliers for design, develop and manage existing suppliers.
Interact with suppliers and optimize designs based on supplier's processes and capabilities.
Work with cross-functional groups to determine package requirements.
Design from concept to volume production to meet the electrical, optical, mechanical , thermal, and reliability requirements.
Perform tolerance analysis of opto-mechanical components and subassemblies. Lead or support developing assembly and test method to validate the design.
Generate opto-mechanical component drawings, layouts, assembly drawings for product and tooling.
Work with Manufacturing Ops team on managing and developing the full Bill of Materials, and analyzing data to optimize yield.
We look forward to meeting you and having you join our growing team!
MS with 6+ years of experience or BS with 9+ years of relevant experience
6+ years of experience in the photonics or semiconductor or related industry
Basic understanding of transceiver module assembly processes
Expertise in Zemax or other optical simulation software, including running Monte Carlo simulations to evaluate optical designs and validating them to reality
NPI/Process development leadership, transfer process development learning, problem-solving and manufacturing yield improvement at CM in Asia
Proficiency in opto-packaging design including design of fixtures, tolerance stack management through intelligent fixture design, alignment tools to enable intelligent active and passive alignment processes
Experienced in designing and qualifying high volume single mode TOSA and ROSA products, specify sub-component (lens, isolator, WDM MUX/DEMUX, fiber assembly, etc.) specifications including tolerances
Hands on process development experience for optical alignments - lens and fiber, UV & thermal epoxy curing, epoxy bond line control, flip chip die bonding, wire bonding of laser and photodiode chips on substrate, solder processes, etc.
Solid knowledge of incoming and outgoing QC metrology to guarantee known good designs entering assembly line
Hands on experience on product manufacturing yield improvement and quality control with SPC (such as Cpk, GR&R, Pareto chart), failure and data analysis
Expertise in designing experiments to complete reliability assessment and failure analysis during process development, define path for product (and process) meeting datacenter lifetime requirements, Familiar with Telcordia standards such as GR-468 and GR-1221 optoelectronic devices and optical passive components
Proven track record in product design and development cycle from initial conceptual design to high volume production is highly desirable
Detail oriented problem solver, sense of urgency and commitment to achieve targeted goals.
Team player with good verbal and written communication and interpersonal skills.
Ability to work independently as well as in a team environment across functional and organizational boundaries.
Demonstrated ability to juggle multiple priorities and deliver against a schedule.
Working knowledge with product documentation, schematics, and Bill of Materials.
Capable and open minded to learn new technology.
Ability to use I2C and other protocols to communicate with EICs to enable test development for opto-packaging process
Ability to collect manufacturing wafer to module test correlation data and perform SPC analysis (JMP or Python scripting strongly preferred)
Programming experience using Labview, C/C++, ability to define alignment algorithms, test methods, etc.
Hands on experience in the test system and software development with advanced test equipment such as optical spectrum analyzer (OSA), digital communications analyzer (DCA), high frequency O/E converter, high speed oscilloscope, RF amplifiers, etc.
Intel® Silicon Photonics Product Division (SPPD) is at the forefront of silicon photonics integration. Since announcing the world’s first hybrid silicon laser nearly a decade ago, our team continues to lead the industry with cutting-edge technology and efficient, scalable high-volume manufacturing. Our dedication to advanced development ensures that Intel Silicon Photonics continues to drive future data center bandwidth growth with smaller form factors and higher speeds, from 100G today to 400G and beyond tomorrow. We are looking for great talent to accelerate this journey, so if you are interested in joining our leading organization, then we want to hear from you!
Inside this Business Group
The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.
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