Intel Optical Transceiver Design Lead in Santa Clara, California

Job Description

Intel's Silicon Photonics Product Division is seeking a seasoned technical leader in optical transceiver design to help define architecture and drive development of our most advanced optical interconnect products to transform data center connectivity. These products are ultra high bandwidth density and low-cost and require key innovation in architecture, optical component, IC, module packaging, test, and manufacturing. You will be a key technical leader on this multi-disciplinary R&D team and will be responsible for providing high speed system and transceiver integration leadership. Defining overall transceiver design and individual component specifications consistent with technology capabilities and product performance, cost and power requirements. Defining and aligning internal and external interface specifications with key focus on electrical and high speed. Developing architectural guidelines and design models to accelerate DOE definition and design iterations. Owning and driving detailed transceiver design, tapeout, and performance validation at all phases of product development life cycle from concept to product Identifying technical risks and resolution/mitigation paths


MS or PhD in Electrical Engineering, Physics or closely related technical disciplines

Minimum 6 + years experience in the optical industry to include fiber optics, optical networking, optical and RF modulation, and data networking architectures

System knowledge of current generation and next generation optical transceiver architectures, standards, designs and tradeoffs. Experience with different PAM4/NRZ modulation formats and high speed/RF design of optical transceivers with a proven track record of successful product introduction

Deep understanding of Signal Integrity, Power Integrity and Channel modeling using industry standard tools such as HFSS and ADS

Experience working closely with circuit designers on the design of analog RF front end circuits such as Drivers, Trans-Impedance Amplifiers TIA and limiting amplifiers Good understanding of low noise PLL's and clocking and data recovery architectures

Possess first level IC package design experience including package design and analysis, as well as experience with a wide array of IC package technologies including 2D/3D packaging techniques

Experience with a wide array of optical components and PHY level components including ROSA/TOSA/BOSA sub-components, modulators, passive waveguide componentsUnderstanding of optical polarization impacts, link impairments and link power/OSNR budget estimation

Strong written and verbal communication skills, with the specific ability to communicate and lead effectively across dispersed, multi-disciplinary teams

Possess excellent time and task management skills, strong inter-personal skills and a willingness to travel when required.

Silicon Photonics Product Division SPPD is at the forefront of silicon photonics integration. Since announcing the world's first hybrid silicon laser nearly a decade ago, our team continues to lead the industry with cutting-edge technology and efficient, scalable high-volume manufacturing. Our dedication to advanced development ensures that Intel Silicon Photonics continues to drive future data center bandwidth growth with smaller form factors and higher speeds, from 100G today to 400G and beyond tomorrow. We are looking for great talent to accelerate this journey, so if you are interested in joining our leading organization, then we want to hear from you!

Inside this Business Group

The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

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