Intel Senior Optical Transceiver Design Engineer in Santa Clara, California
We are looking an exceptional candidate to work in a challenging, fast paced environment developing next generation optical modules and engines so that we grow our market share and contribute to Silicon Photonics Product Division's mission to transform and lead datacenter connectivity and enable Intel's differentiation in the networking space. As Senior Optical Transceiver Design Engineer, the individual will be responsible for integrated design of optical transceiver modules at 100Gbps, 400Gbps and beyond in Intel's Silicon Photonics Products Division. Define transceiver module architecture and engineering specifications based on product-level requirements from technical marketing team- Interact with broad interdisciplinary team composed of experts in optical devices, electrical ICs, optical and electrical component packaging, PCB design, mechanical/thermal design, firmware and embedded software, manufacturing operations and test, design validation, quality and reliability, etc. to deliver optical transceivers from R&D to high-volume production with superior performance, reliability, cost and time to market versus the competition
Masters of Science, Ph.D. or equivalent experience in Electrical Engineering or closely related field, plus 6+ years of experience in fiber optics, optical networking, optical and RF modulation, and data networking architectures
Demonstrated through successful product and systems development experiences involving complex EO components, sub-systems, and systems such as optics, digital/analog signal processing electronics.
Experience with physical layer optical transmission systems, ROSA/TOSA/BOSA, Mach-Zehnder modulators, burst receivers, optical polarization, link impairments and link power/OSNR budget estimation, is required
Direct contribution to technical solutions that integrate multiple disciplines or technologies into non-obvious system architectures that provide meaningfully unique and differentiated capability requires understanding of current and proposed competitive solutions, key performance indicators, and end-user mission objectives as well as understanding of interplay between technologies and engineering design T
Track record of developing models for operational environments, performing trade studies and sensitivity analyses, and comparing alternative architectures with system performance estimates and pragmatic estimation of unknown parameters
Can articulate what and how key system performance parameters should be tested early, can outline and write verification test plans for subsystem and system elements, can perform the testing and analyze the results
Demonstrated ability to enter the customer's environment, find out how the customer will use the system, and translate that voice of customer into requirements and trade-offs that can be evaluated via alternative designs additional skill in successfully influencing system requirements at the end customer desired
First level IC package design experience to include package design and analysis, broad package technology experience, circuit designer engagement experience
Deep understanding of RF IC Transceiver architectures, design & tradeoffsExperience with design of high speed mixed signal circuits e.g., SerDes - analog/DSP based architectures, RX/TX equalizationExperience with design of Analog RF front end circuits such as Drivers, Trans-Impedance Amplifiers TIA, limiting amplifiers, etc.
Good understanding of low noise PLL, Clocking and data recovery architectures. Deep understanding of Signal Integrity, Power Integrity and Channel modeling using industry standard tools such as HFSS, ADS etc
System knowledge of current generation and next generation optical transceiver architectures and standards.
Strong written and verbal communication skills, with the specific ability to speak to various technical and management levels.
Proactive, collaborative and creative approach to innovation, technical development and consensus facilitation to influence optimal project results.
Excellent time and task management, and inter-personal skills.
Willingness to travel when required
Intel® Silicon Photonics Product Division (SPPD) is at the forefront of silicon photonics integration. Since announcing the world’s first hybrid silicon laser nearly a decade ago, our team continues to lead the industry with cutting-edge technology and efficient, scalable high-volume manufacturing. Our dedication to advanced development ensures that Intel Silicon Photonics continues to drive future data center bandwidth growth with smaller form factors and higher speeds, from 100G today to 400G and beyond tomorrow. We are looking for great talent to accelerate this journey, so if you are interested in joining our leading organization, then we want to hear from you!
Inside this Business Group
The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.
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