Intel Staff / Snr. Staff Process Engineer - Thin Films - Expatriate for Dalian China in Santa Clara, California

Job Description

Posting Title: Staff / Sr. Staff Process Engineer - Thin Films

Job Description:

Intel's Non-Volatile Memory Solutions Group is hiring experienced Process Development Engineers in the process area of Thin Films CVD/ALD/PVD to develop world class semiconductor manufacturing processes. The ideal candidate will have a successful track record of delivering leading edge process capability, yield, cost and manufacturability. This will involve exceptional collaboration with cross-functional/cross-company teams and tool vendors to meet device requirements for next-generation memory products. In addition to dry etch you will also be responsible for process module development for memory devices.

Job responsibilities include:

  • Design and optimize Thin Films CVD/ALD/PVD processes for leading edge memory technology.

  • Defining and establishing flow, procedures, and equipment configuration for the module.

  • Selecting and developing material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements.

  • Conducting process, equipment and material development projects with equipment and material suppliers. This will involve exceptional collaboration with cross-functional/cross-company teams and tool vendors to meet challenging program goals.

  • Designing, executing and analyzing experiments necessary to meet engineering specifications for their process.

  • Working effectively with the equipment supplier to identify shortcomings, propose and evaluate hardware modification to mitigate issues.

  • Driving improvements on quality, reliability, cost, yield, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel.

  • Developing solutions to problems utilizing formal education, statistical knowledge, and problem solving tools.

  • Establishing process control systems for the process module.

  • Training production/receiving process engineers in high volume factories.

  • Transferring processes to high volume manufacturing and providing support in new factory startup.

  • Domestic and International travel, as necessary to support job responsibilities

  • Identify potential intellectual properties (IP) opportunities and file disclosures

Qualifications

Qualifications:

  • PhD degree (or MS) in Electrical Engineering, Chemical Engineering, Material Science, Physics, Chemistry or an equivalent field. 5+ years of experience in semiconductor process and/or equipment development.

  • Strong understanding of solid state physics, dielectrics, metal oxides, metals, surfaces, and interfaces

  • Strong understanding of fundamental challenges in materials exploration for device scaling.

  • In-depth understanding of chemical kinetics in various deposition reactors.

  • Ability to use various solid mechanics to explain stresses, deformations, and shrinkage in deposited thin films.

  • A good understanding of various thin film electrical evaluation methods and techniques.

  • Strong understanding of surface and analytical characterization techniques such as ICPMS, SIMS, XPS, SEM, TEM, etc.

Additional Requirements:

  • Must have technical expertise within semiconductor processing engineering preferably in Memory process development for leading edge technology

  • Demonstrate experience with technical problem solving skills, with multitasking

  • Demonstrated experience working with external and internal partners, including leading edge semiconductor equipment and/or materials manufacturers.

  • A fast learner, able to adapt to the culture and the technology

  • Must be flexible in accommodating changing priorities and working hours to support business needs

Primary Location: Dalian China

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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